| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 543627 | Microelectronic Engineering | 2008 | 7 Pages |
In this study, the approach of composite solder using eutectic Sn–3.5Ag solder and Co was tried. Co particles and Sn–3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn–3.5Ag solder pastes, their melting temperatures and spreading areas were measured. The solder pastes were stencil printed on test substrates and reflowed to form solder bumps. Ball shear test was performed to examine shear strength of Co-reinforced Sn–3.5Ag solder bumps. As a result, Co addition up to 2 wt.% did not alter the melting temperature under heating but reduced undercooling. The maximum shear strength of Co-reinforced Sn–3.5Ag solder bumps increased by 28% compared to normal ones. The increase in shear strength can be attributed to the (Cu,Co)3Sn2 intermetallic compounds.
