Pressure and resist thickness dependency of resist time evolutions profiles in nanoimprint lithography

Time evolutions of the resist deformation process in thermal nanoimprint have been investigated by numerical simulation and experiments. The simulation and experiments relatively agree with each other in time evolutions of the resist profiles. Dependencies of the process time on both imprint pressure and initial resist thickness are evaluated. In both simulation and experiments, the process time is in inversely proportional to the imprint pressure. On the other hand, the process time increases as the initial thickness decreases. Also, tiny twin peaks are observed in thick resist process.