Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
543713 | Microelectronic Engineering | 2008 | 4 Pages |
Abstract
This study describes the fabrication of Si molds by using electron beam lithography (EBL) combined with inductively coupled plasma (ICP) etching and its application to the hot-emboss of polyimide (PI) microfluidic platform. The dynamic mechanical thermal properties and the formability of a polyimide film were investigated as a function of temperature by dynamic mechanical thermal analysis (DMTA) and hot-embossing tests. Based on the results, the microfluidic channel could be replicated on PI surface with good fidelity by hot-embossing with the Si mold structured by using EBL combined with ICP etching.
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Authors
Sung-Won Youn, Toshihiko Noguchi, Masaharu Takahashi, Ryutaro Maeda,