| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 544031 | Microelectronic Engineering | 2007 | 4 Pages | 
Abstract
												We present the current state-of-the-art of geometric phase analysis (GPA), a technique for measuring stress and strain at the nanoscale by high-resolution transmission electron microscopy (HRTEM). The method will be illustrated with an experimental study of SiGe strained layers using the SACTEM-Toulouse, an aberration-corrected transmission electron microscope. This latest generation machine improves signal-to-noise allowing deformations to be measured to an accuracy of 0.1% at nanometre scale resolution. The relation between strain and deformation will be discussed in the light of thin film relaxation and chemical interdiffusion.
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											Authors
												M.J. Hÿtch, F. Houdellier, 
											