| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 544048 | Microelectronic Engineering | 2007 | 4 Pages |
Modification of SiO2 precipitate formation by defect engineering of SIMOX (separation by implanted oxygen) process was studied using cross section scanning spreading resistance microscopy (SSRM). Firstly, open volume defects, nanocavities, have been introduced by He+ ion implantation in the region, where SiO2 precipitates were subsequently formed. Secondly, dual (simultaneous) oxygen (O+) and silicon (Si+) implantation was used to modify SiO2 reaction kinetics too. The results show that the He-induced nanocavities enhance the SiO2 formation presumably releasing excess strain associated with Si oxidation, while the use of a dual O+/Si+ beam do not influence significantly the oxidation kinetics in the initial state of the SIMOX process in our samples. Overall, SSRM was shown to be a suitable method for observation of the early stage of buried oxide formation in Si, since it measures the local resistivity, the main functional parameter of a SIMOX structure.
