Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
544286 | Microelectronic Engineering | 2013 | 4 Pages |
Electron beam (e-beam) exposure of insulating material gives rise to charge accumulation which degrades pattern resolution and position during lithography and observation. In this paper we propose a process which reduces significantly the artifacts due to charging effects by using a charge dissipater based on a bi-layer deposited on top of the insulating substrate. The first layer is an inorganic thin film and soluble in water at room temperature, while the second layer is a metallic thin film. We reported the results of this process during e-beam lithography and observation of insulating samples.
Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideHighlights► The bi-layer coating process for anti-charging effects of insulating materials. ► This process is non-destructive because the bilayer is removed by water. ► The electron beam observation and lithography results show clear evidence of the efficiency of the process.