Article ID Journal Published Year Pages File Type
544286 Microelectronic Engineering 2013 4 Pages PDF
Abstract

Electron beam (e-beam) exposure of insulating material gives rise to charge accumulation which degrades pattern resolution and position during lithography and observation. In this paper we propose a process which reduces significantly the artifacts due to charging effects by using a charge dissipater based on a bi-layer deposited on top of the insulating substrate. The first layer is an inorganic thin film and soluble in water at room temperature, while the second layer is a metallic thin film. We reported the results of this process during e-beam lithography and observation of insulating samples.

Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideHighlights► The bi-layer coating process for anti-charging effects of insulating materials. ► This process is non-destructive because the bilayer is removed by water. ► The electron beam observation and lithography results show clear evidence of the efficiency of the process.

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