| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 544301 | Microelectronic Engineering | 2013 | 6 Pages |
Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideHighlights•By μED-milling a structure width of 50 μm with Ra,μEDM = (94 ± 1.0) nm is achieved.•Die-sinking μEDM offers a process time reduction by about 90% comparable to μEDM.•A combination of μED-milling & electrochemical polishing reduces Ra by about 75%.•Solid nanoparticles are produced with high pressure homogenization up to 2000 bar.
This paper presents an innovative process chain, that is based on microelectrical discharge machining for the fabrication of 3D microsystems made of stainless steel. The fabrication process cluster consists of three technologies: microelectrical discharge milling, die-sinking microelectrical discharge machining and a subsequent electrochemical polishing step. The described fabrication processes are applied to design a microsystem for the integrated generation and loading of drug carrier systems. μED-milling orifices with a minimum width of 50 μm and a surface roughness of Ra,μEDM = (94.9 ± 1.0) nm are fabricated. The application of a subsequent electrochemical polishing step improves the surface quality to Ra,ECP = (22.1 ± 1.3) nm. Solid lipid nanoparticles were efficiently produced with a mean particle size of 135 nm within one emulsification cycle.
