Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
544308 | Microelectronic Engineering | 2013 | 5 Pages |
•A Ni shadow mask with circular holes with diameters of 150–400 μm was fabricated by electroplating.•Magnetic clamping of shadow mask and substrate was implemented.•Wafer-scale spray coating of polymer patterns was achieved.•Magnetic clamping proved to be essential for pattern replication.
We present the fabrication of a wafer-scale shadow mask with arrays of circular holes with diameters of 150–400 μm. Standard UV photolithography is used to define 700 μm thick SU-8 structures followed by electroplating of nickel and etching of the template. The ferromagnetic properties of the shadow mask allow magnetic clamping to the substrate and spray coating of well defined polymer patterns.
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