| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 544345 | Microelectronic Engineering | 2012 | 5 Pages |
The fast and precise deflection of electron-beams is mandatory for common electron beam tools and next generation multi-beam lithography systems. Electrostatic fields generated by an arrangement of electrodes with several electric potentials are used to control the electron beam. The miniaturization of such a beam-deflection system facilitates its integration at a favorable place within the electron-optical column. An efficient and accurate beam deflection with high sensitivity and low aberrations is consequently possible.The novel wire-based electrostatic deflector for electron-beam Lithography Tools presented in this paper strictly pursues this approach. Design investigations as well as manufacturing and alignment procedures are reported. 24 wire electrodes are arranged in a circular FEA-optimized pattern and kinematically well-defined mounted to a supporting structure using the Solderjet Bumping technique [2] and [3]. This flux free solder technique ensures vacuum compatible joints free of hydrocarbons and with an excellent long-term stability.A prototype of the wire deflector is measured by means of a high resolution X-ray computer tomography scanner (CT) [4]. The single wire elements of the wire deflector are symmetrically arranged to each other within an accuracy of a few microns.
Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideHighlights► Simulation and CAD design of a wire deflector. ► Manufacturing of a prototype consisting of 24 wire electrodes. ► CT measurements for characterization. ► Assembly accuracy of single electrodes less than 10 μm.
