Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
544381 | Microelectronic Engineering | 2012 | 4 Pages |
We fabricated arrays of cantilever sensors suspended deep inside fluid wells. To eliminate critical alignment and assembling steps during encapsulation of the cantilevers, these 3-D MEMS devices are realized in a single-side, single-wafer process by employing photolithography on bulk micromachined substrates. Silicon nitride cantilevers with varying geometries are suspended up to 100μm below the wafer surface, and a structured gold layer is patterned on top. After calibrating the cantilevers in an optical lever setup, the formation of a DNA monolayer on the cantilever surface is detected.
Graphical abstractFigure optionsDownload full-size imageDownload as PowerPoint slideHighlights► Cantilever sensors integrated in individual fluid wells. ► Gold patterning by contact lithography through a 100 μm gap. ► Encapsulated cantilever sensors in a single wafer by single-side processing. ► Capping MEMS without alignment.