Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
544496 | Microelectronic Engineering | 2011 | 9 Pages |
Abstract
For lead-free solders in the high-temperature regime, unfortunately, a limited number of alloying systems are available. These are Bi based alloys, gold involving alloys and Zn–Al based alloys. Based on these systems, possible candidate alloys were designed to have a melting range between 270 °C and 350 °C. Each has its own superior characteristics as well as some drawbacks however none of them can fulfill all the requirements to replace the current high-lead content solders. Even the alternative technologies that are currently being developed cannot address several critical issues of high-temperature soldering. Therefore, further research and development of high-temperature lead-free soldering is obviously needed.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Vivek Chidambaram, Jesper Hattel, John Hald,