Article ID Journal Published Year Pages File Type
544506 Microelectronic Engineering 2011 4 Pages PDF
Abstract

We report on a two step soft UV nanoimprint process termed “Press and Release Imprint (PRI) that enables the reduction of both the mold deformation and the local variation of the residual layer thickness, thereby allowing high fidelity pattern replication with a uniform local residual layer thickness. The effect of imprint pressure on the mold deformation, local variation of residual layer thickness as well as required mold release time has been investigated for microscale patterns in the range of 10–100 μm. The potentials of PRI are demonstrated by high fidelity replication of micro-patterns with a uniform residual layer of minimum thickness.

Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Authors
, , , , ,