| Article ID | Journal | Published Year | Pages | File Type | 
|---|---|---|---|---|
| 544541 | Microelectronic Engineering | 2011 | 4 Pages | 
Abstract
												We investigated the relationship between thermal stability of NiSi films and the implanted dopant species on Si substrates. The most stable NiSi layer appeared on Boron-implanted Si substrate, where the formation of pseudo-epitaxial transrotational structure was observed, just in case that the dose of boron is more than 5e15 atoms/cm2. This unique crystallographic orientation of NiSi film on Boron-implanted substrate is a key role of thermal stability because thermal stress at grain boundary can be diminished by peculiar arrangement of transrotational domains, owing to the anisotropy in coefficient of thermal expansion (CTE) of NiSi.
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											Authors
												Hiroshi Kimura, Ryuji Tomita, 
											