Influence of current density on mechanical reliability of Sn–3.5Ag BGA solder joint

In this study, we investigated the effect of the current density on the interfacial reaction and mechanical reliability of an electroless Ni/immersion Au (ENIG) substrate with Sn–3.5Ag solder. We first evaluated the interfacial reactions of the solder joint under aging for up to 800 h and current stressing with current densities of 3 × 102 A/cm2 and 5 × 103 A/cm2. Also, we successfully revealed the correlation between the interfacial reaction behavior and mechanical reliability under current stressing. With increasing aging time, the thickness of the Ni3Sn4 layer increased. At both low and high current densities, the thickness of the Ni3Sn4 layer increased up to 400 h and decreased thereafter at the cathode, while that of the IMC increased up to 800 h at the anode. After the die shear test, the ductile fracture was observed in the as-reflowed joint without current stressing. The fracture mode changed from ductile fracture to brittle fracture when thermal aging and current flow were simultaneously applied. The combination of the current stressing and isothermal aging at high temperature significantly deteriorated the mechanical reliability of the solder joint.