| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 544759 | Microelectronic Engineering | 2011 | 4 Pages |
Abstract
The replication of microstructures with undercuts by UV-moulding was studied. The pattern transfer from a silicon master into hard acrylate formulations results in defects by sheering away the undercut sections of the replica. By means of the admixture of high elastic acrylates to the formulation the replication of 3D-microstructures with larger undercuts could be achieved. The differences in the replication defect formation for imprinting and UV-moulding are due to the differences in the elasticity of master and replica and the dissimilar distribution of the forces at demoulding.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Christian Elsner, Joachim Zajadacz, Klaus Zimmer,