Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
544808 | Microelectronic Engineering | 2010 | 4 Pages |
Abstract
This study examined imprint lithography with a two-step Ni stamp to solve the laser process problems and simultaneously form a blind via and layer pattern. The Ni stamp was fabricated by electroplating on a dry-etched Si mold, made from a SOI (silicon on insulator) wafer, and pattern replication. For the pattern transfer of the Ni stamp, hot embossing was performed on SU8-coated BT and Si wafer substrates. The residual layer was of a uniform thickness with an embossed shape of acceptable squareness.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
In-Soo Park, Jin-Soo Kim, Seong-Hun Na, Seung-Kyu Lim, Young-Soo Oh, Su-Jeong Suh,