Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6942453 | Microelectronic Engineering | 2018 | 16 Pages |
Abstract
Roll-to-Roll microreplication combines the precision of hot embossing with continuous cost efficient replication on polymer films on large scale. For a viable realisation of this process, the main challenge for Roll-to-Roll hot embossing is the transfer from conventional flat silicon based micro structuring technology, to curved, large scale surfaces on continuously working rolls. This article presents lithography and electroplating based fabrication method of seamless microstructured sleeves and the Roll-to-Roll microreplication in a selection of high performance polymers like PEEK, LCP, PTFE, FEP, PSU and metal films such as aluminum and copper.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
A. Striegel, M. Schneider, N. Schneider, Ch. Benkel, M. Worgull,