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Electrical characteristics of a novel interposer technique using ultra-low-resistivity silicon-pillars with polymer insulation as TSVs

Article ID Journal Published Year Pages File Type
6943514 Microelectronic Engineering 2015 7 Pages PDF
Abstract
Schematic diagram of the proposed interposer.
Keywords
Through-silicon-vias (TSVs)Benzocyclobutene (BCB)
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Preview
Electrical characteristics of a novel interposer technique using ultra-low-resistivity silicon-pillars with polymer insulation as TSVs
Authors
Weijiang Wang, Yangyang Yan, Yingtao Ding, Shiwei Wang, Weimin Wang, Yipeng Sun, Qianwen Chen,
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Journal
Microelectronic Engineering
Journal: Microelectronic Engineering
Related Categories
Through-silicon-vias (TSVs)
Benzocyclobutene (BCB)
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Computer Science Applications
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