| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6943658 | Microelectronic Engineering | 2014 | 5 Pages |
Abstract
- Influence of additives is considered by a set of experimental Tafel curves.
- TSV filling experiments have been carried out to validate the modeling results.
- Superfilling of through silicon via can be predicted with this numerical modeling.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Yunhui Zhu, Shenglin Ma, Xin Sun, Jing Chen, Min Miao, Yufeng Jin,