Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6943743 | Microelectronic Engineering | 2013 | 4 Pages |
Abstract
- A nondeforming chucking technique for EUV lithography has been developed.
- Temperature distribution and shear and tension forces during freezing were calculated by FEM.
- Shear strength of 0.2 N per pin and tensile strength of 0.34 N per pin, and solidification deformation below ±0.15 μm were measured.
- The new freezing pin chuck has the pitch of 2 mm and are cooled with coolant of 5 °C.
- The new chuck can clamp the low expansion glass mask without deformation at temperatures below 50 °C.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Atsunobu Une, Nagahisa Ogasawara, Kenichiro Yoshitomi, Masaaki Mochida,