| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6943757 | Microelectronic Engineering | 2013 | 5 Pages |
Abstract
- This study aimed to maximize the material removal rate and minimize the within wafer non-uniformity simultaneously.
- The design of experiment approach was used to optimize the process parameters for CMP of a 12-inch wafer.
- Confirmation tests indicated that MRR of 6551Â Ã /min and WIWNU of 4.72% can be obtained using the optimum combination.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Tongqing Wang, Xinchun Lu, Dewen Zhao, Yongyong He, Jianbin Luo,