Article ID Journal Published Year Pages File Type
6943899 Microelectronic Engineering 2013 4 Pages PDF
Abstract

- Double-insulator scheme by different deposition methods are first studied.
- E-beam-based SiO2 shows the best result due to the reduction of gate leakage current.
- E-beam-based SiO2 and double scheme form a competitive insulator for HEMT.
- Authors plan to try other tool, such as LPCVD, TCVD and ADM to obtain optimal result.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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