Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6943899 | Microelectronic Engineering | 2013 | 4 Pages |
Abstract
- Double-insulator scheme by different deposition methods are first studied.
- E-beam-based SiO2 shows the best result due to the reduction of gate leakage current.
- E-beam-based SiO2 and double scheme form a competitive insulator for HEMT.
- Authors plan to try other tool, such as LPCVD, TCVD and ADM to obtain optimal result.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Cong Wang, Sung-Jin Cho, Nam-Young Kim,