| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6943965 | Microelectronic Engineering | 2013 | 9 Pages |
Abstract
- A comprehensive process model for rinse process in single-wafer tools is presented.
- Process model used to develop new rinse recipes for hafnium-based patterned wafers.
- Key process parameters: speed of rotation, flow rate, and wafer size are studied.
- Determined the bottleneck of the rinse process to minimize the water usage.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Davoud Zamani, Kedar Dhane, Omid Mahdavi, Michael Anthony McBride, Jun Yan, Farhang Shadman,