Article ID Journal Published Year Pages File Type
6943965 Microelectronic Engineering 2013 9 Pages PDF
Abstract

- A comprehensive process model for rinse process in single-wafer tools is presented.
- Process model used to develop new rinse recipes for hafnium-based patterned wafers.
- Key process parameters: speed of rotation, flow rate, and wafer size are studied.
- Determined the bottleneck of the rinse process to minimize the water usage.
Keywords
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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