| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6943969 | Microelectronic Engineering | 2013 | 5 Pages |
Abstract
- An eddy current measurement system for Cu thickness in CMP was established.
- The nano-scale sensitivity under large lift-off distance was reached by optimizing.
- The differential method for signal processing avoids the drift of system.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Zilian Qu, Qian Zhao, Yonggang Meng, Tongqing Wang, Dewen Zhao, Yanwu Men, Xinchun Lu,