Article ID Journal Published Year Pages File Type
6944008 Microelectronic Engineering 2013 4 Pages PDF
Abstract

- Two-step high-pressure sputtering for Gd2O3 deposition on InP substrates.
- Working MIS devices for all sputtering and plasma oxidation conditions.
- High capacitance (CET of 2.4 nm) with moderate leakage (under 10−3 A cm−2 at a gate voltage of 1 V).
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Authors
, , , , ,