| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6944191 | Microelectronic Engineering | 2012 | 7 Pages |
Abstract
⺠Silver micro-joints for flip-chip interconnect are formed between silicon chips and copper substrates by solid state bonding. ⺠No flux is used during bonding. ⺠Bonding temperature is compatible with typical reflow temperature of lead-free solders used in industries. ⺠Solid state bonding occurs when silver and copper atoms are brought within atomic distance so as to share electrons. ⺠Silver joints do not contain intermetallic compound, avoiding reliability issues associated with its growth.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Chu-Hsuan Sha, Chin C. Lee,