Thermo-mechanical analysis of TSV and solder interconnects for different Cu pillar bump types

Article ID	Journal	Published Year	Pages	File Type
6944215	Microelectronic Engineering	2012	5 Pages	PDF

Abstract

âº FE modelling of Cu pillar bumps of different types. âº Stress distribution in solder interface and TSV interface. âº Reliability of conical frustum type is excellent than other types.

Keywords

Von Mises stress Through Silicon Via Solder bump

Related Topics

Physical Sciences and Engineering Computer Science Hardware and Architecture

Preview

Thermo-mechanical analysis of TSV and solder interconnects for different Cu pillar bump types

Authors

SeMin Park, HanSur Bang, HeeSeon Bang, JaeSun You,