| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6944264 | Microelectronic Engineering | 2012 | 5 Pages |
Abstract
⺠This study looks at ENEPIG, as it is paired with three solder compositions. ⺠Board-level chip-scale packages subjected to a JEDEC drop test. ⺠Sb, Ni and Pt were minor doped for enhancing strength and good wettability. ⺠The drop performances of ENEPIG are found better than those of Ni/Au. ⺠Most of the failure modes are on the test board side along the brittle interfaces.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Tong Hong Wang, Chung-Hung Tsai, Yi-Shao Lai,