| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6944305 | Microelectronic Engineering | 2012 | 6 Pages |
Abstract
⺠A simple and novel method to evaluate the adhesion properties of UV curable resin for UV-NIL. ⺠The pull-off test between a stamp and UV curable resin. ⺠The effect of the process conditions on the pull-off force. ⺠This test method can be useful to select the materials and the process conditions for UV-NIL.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Jung-Chul Heo, Kwang-Seop Kim, Kyung-Woong Kim,