Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6944481 | Microelectronic Engineering | 2012 | 4 Pages |
Abstract
⺠The resist thickness, pressure and contact angle as the factors. ⺠To understand factors, NIL experiments and NIL simulations have been conducted. ⺠NIL experiment by ANT-2T and NIL simulations by FLUENT. ⺠Capillary force is dominant at the low pressure in NIL process. ⺠Contact angles are reduced as pressure increases.
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Authors
JiHyeong Ryu, HyungJun Lim, Mira Jeong, JaeJong Lee,