Article ID Journal Published Year Pages File Type
6944491 Microelectronic Engineering 2012 4 Pages PDF
Abstract
► A parametric study for ICP etching of InAs and InSb in BCl3/Cl2/Ar plasma is reported. ► They have similar results with respect to the change of gas composition, pressure, ICP and RF power. ► An optimized room temperature etching process has been developed. ► Moderate anisotropic etching rate with ultra-smooth surfaces is achieved.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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