| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6944500 | Microelectronic Engineering | 2012 | 4 Pages |
Abstract
⺠The first results of tensile stress tests of thin film Au wires on a PI substrate. ⺠The test structures were fabricated by stencil lithography using SiN stencils. ⺠Within the limit of elastic deformation, the resistance change was less than 6%. ⺠No change of thin film surface morphology was found after 10000 of stretching cycles. ⺠Stencil lithography is a promising fabrication method for stretchable interconnects.
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Authors
MiloÅ¡ FrantloviÄ, Ivana JokiÄ, Veronica Savu, Shenqi Xie, Jürgen Brugger,