| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6944552 | Microelectronic Engineering | 2012 | 5 Pages |
Abstract
⺠Thermal Step and Repeat NIL processes characterized by scatterometry. ⺠Scatterometry demonstrates high accuracy to quantify imprinted lines on silicon. ⺠Polymer reflow due to heat diffusion has been studied as a function of printing parameters.
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Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
C. Gourgon, A.K. Ferchichi, D. Pietroy, T. Haatainen, J. Tesseire,