Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9670482 | Microelectronic Engineering | 2005 | 4 Pages |
Abstract
Chemically conformal deposition of SrTiO3 (STO) thin films was successfully achieved by ALD using conventional metal organic precursors and remote-plasma activated H2O. It was found that the ALD behavior of the STO film was critically dependent on the Sr(thd)2 source bubbling temperature. When the Sr-source bubbling temperature was < â¼Â 200 °C (Sr(thd)2 melting temperature), the deposition proceeded in a genuine ALD mode and stoichiometric STO films were deposited with a good process reliability. Relatively good electrical properties were obtained from a planar capacitor structure with Pt top and Ru bottom electrodes. A 19.5-nm-thick STO film showed an equivalent oxide thickness (EOT) of 0.8 nm and a leakage current density of 1.98 Ã 10â6 A/cm2 at 1V after post-annealing.
Keywords
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Sang Woon Lee, Oh Seong Kwon, Cheol Seong Hwang,