Article ID Journal Published Year Pages File Type
9670482 Microelectronic Engineering 2005 4 Pages PDF
Abstract
Chemically conformal deposition of SrTiO3 (STO) thin films was successfully achieved by ALD using conventional metal organic precursors and remote-plasma activated H2O. It was found that the ALD behavior of the STO film was critically dependent on the Sr(thd)2 source bubbling temperature. When the Sr-source bubbling temperature was < ∼ 200 °C (Sr(thd)2 melting temperature), the deposition proceeded in a genuine ALD mode and stoichiometric STO films were deposited with a good process reliability. Relatively good electrical properties were obtained from a planar capacitor structure with Pt top and Ru bottom electrodes. A 19.5-nm-thick STO film showed an equivalent oxide thickness (EOT) of 0.8 nm and a leakage current density of 1.98 × 10−6 A/cm2 at 1V after post-annealing.
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