Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9670488 | Microelectronic Engineering | 2005 | 4 Pages |
Abstract
A model is proposed and validated for the degradation mechanisms occurring in ultra-thin SiO2 at real operation conditions, based on high-resolution, high-speed in-situ measurements. This state-of-the-art set-up proves that oxide degradation still occurs at low stress conditions and allows distinguishing quantitatively the SILC-contribution from the contribution due to trapping.
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Authors
S. Aresu, W. De Ceuninck, R. Degraeve, B. Kaczer, G. Knuyt, L. De Schepper,