Article ID Journal Published Year Pages File Type
9670488 Microelectronic Engineering 2005 4 Pages PDF
Abstract
A model is proposed and validated for the degradation mechanisms occurring in ultra-thin SiO2 at real operation conditions, based on high-resolution, high-speed in-situ measurements. This state-of-the-art set-up proves that oxide degradation still occurs at low stress conditions and allows distinguishing quantitatively the SILC-contribution from the contribution due to trapping.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
Authors
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