Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9670514 | Microelectronic Engineering | 2005 | 4 Pages |
Abstract
MFIS capacitors with Pb(Zr0.53, Ti0.47)O3 (PZT) ferroelectric layer and HfO2, La2O3 and Dy2O3 insulator layers were fabricated and characterized. The size of the capacitance-voltage (C-V) memory windows was investigated. The maximum memory windows of MFIS capacitors with La2O3 and Dy2O3 insulators are close to the theoretical value ÎW â 2dfEc â 1.8 V. The temperature dependence of the current conduction mechanisms through the MFIS capacitors was also investigated. In the temperature range of 375-450 K, the electrical conduction of MFIS capacitors with HfO2 and Dy2O3 insulators is space-charge-limited current (SCLC), whereas for Al/PZT/La2O3/Si capacitor Poole-Frenkel emission was the dominant mechanism at higher fields (⩾0.8 MV/cm) in the temperature range from 325 K to 400 K.
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Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Pi-chun Juan, Yu-ping Hu, Fu-chien Chiu, Joseph Ya-min Lee,