Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9670569 | Microelectronic Engineering | 2005 | 6 Pages |
Abstract
We present the results from a thorough investigation of the bond strength between the photo-polymer SU-8 and Au. The data were obtained by pull-test experiments, below the glass transition temperature of the polymer. The different aspects that we investigated were: (i) the effect of using different adhesion promoters between the SU-8 and Au; (ii) the influence of the processing sequence, keeping either Au or SU-8 as the bottom layer; (iii) the importance of the UV exposure dosage of the SU-8. For comparison, also the bond strength between SU-8 and other materials was measured. For SU-8 and Au without any adhesion promoter we find a bond strength of 4.8 ± 1.2 MPa for a 7.5-μm-layer of SU-8. The value of the bond strength can be increased additionally by up to 75% using an adhesion promoter and fully optimising the processing conditions of the SU-8.
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Authors
Maria Nordström, Alicia Johansson, Encarnacion Sánchez Noguerón, Bjarne Clausen, Montserrat Calleja, Anja Boisen,