Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9670595 | Microelectronic Engineering | 2005 | 5 Pages |
Abstract
We have demonstrated subwavelength aluminum (Al) gratings with a period of 200Â nm using nanoimprint lithography (NIL) and reactive ion etching (RIE). Al dry etching was attempted using the etch mask formed by NIL. The SiO2 stamp with a size of 5Â ÃÂ 5Â cm2 was fabricated using laser interference lithography and RIE. The NIL process was optimized on Al/glass substrate and various imprint resists were tested for the Al etching. We could obtain a vertical etching profile and an etch selectivity of 2 with mrI-8020 imprint resist. The Al RIE combined with NIL will be useful for the realization of subwavelength Al gratings with a high aspect ratio.
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Authors
Seh-Won Ahn, Ki-Dong Lee, Jin-Sung Kim, Sang Hoon Kim, Sarng H. Lee, Joo-Do Park, Phil-Won Yoon,