Article ID Journal Published Year Pages File Type
9670600 Microelectronic Engineering 2005 6 Pages PDF
Abstract
In this work, we demonstrate a simple, single-step process using electron-beam lithography to write parallel ribs of cross-linked UV-3 resist. The resist is spun on to a SiO2 layer on a silicon substrate. If the resist thickness, electron dose, rib width and gap width all lie within a limited range, then the ribs collapse or fold towards each other making a sealed contact at the apex. This action depends on the exploitation of the forces of surface tension and capillarity during the final drying process.
Related Topics
Physical Sciences and Engineering Computer Science Hardware and Architecture
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