Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
9670600 | Microelectronic Engineering | 2005 | 6 Pages |
Abstract
In this work, we demonstrate a simple, single-step process using electron-beam lithography to write parallel ribs of cross-linked UV-3 resist. The resist is spun on to a SiO2 layer on a silicon substrate. If the resist thickness, electron dose, rib width and gap width all lie within a limited range, then the ribs collapse or fold towards each other making a sealed contact at the apex. This action depends on the exploitation of the forces of surface tension and capillarity during the final drying process.
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Authors
J.L. Pearson, D.R.S. Cumming,