Article ID | Journal | Published Year | Pages | File Type |
---|---|---|---|---|
6943323 | Microelectronic Engineering | 2015 | 6 Pages |
Abstract
In this work we demonstrate that Reverse Nanoimprint Lithography is a feasible and flexible lithography technique applicable to the transfer of micro and nano polymer structures with no residual layer over areas of cm2 areas on silicon, metal and non-planar substrates. We used a flexible polydimethylsiloxane stamp with hydrophobic features. We present residual layer-free patterns imprinted using a commercial poly(methylmethacrylate) thermoplastic polymer over silicon, nickel and pre-patterned substrates. Our versatile patterning technology is adaptable to free form nano structuring and has coupling to adhesion technologies.
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Authors
Ariadna Fernández, Juan Medina, Christian Benkel, Markus Guttmann, Brian Bilenberg, Lasse H. Thamdrup, Theodor Nielsen, Clivia M. Sotomayor Torres, Nikolaos Kehagias,