| Article ID | Journal | Published Year | Pages | File Type |
|---|---|---|---|---|
| 6943972 | Microelectronic Engineering | 2013 | 5 Pages |
Abstract
- We have proposed a novel weakly alkaline barrier slurry without inhibitors and unstable H2O2 for barrier CMP.
- The slurry has an effectively effect on the correction of dishing and erosion.
- The slurry provides a lower copper loss.
- The slurry has been applied in barrier CMP.
Related Topics
Physical Sciences and Engineering
Computer Science
Hardware and Architecture
Authors
Chenwei Wang, Jiaojiao Gao, Jianying Tian, Xinhuan Niu, Yuling Liu,