Keywords: پوشش الکتریکی مس; Electroless copper plating; Calix[4]arenes additives; Electrochemical measurements;
مقالات ISI پوشش الکتریکی مس (ترجمه نشده)
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Keywords: پوشش الکتریکی مس; Phase-change material; Urea-formaldehyde microcapsules containing paraffin particle; Electroless copper plating; Low infrared emissivity; Enthalpy;
Keywords: پوشش الکتریکی مس; Mesophase pitch-based carbon foams; Electroless copper plating; Vacuum assisted; Ultrasonic assisted
Keywords: پوشش الکتریکی مس; Phenolic resin matrix composite; Electroless copper plating; Sensitization; Adhesion;
A facile process to manufacture high performance copper layer on ceramic material via biomimetic modification and electroless plating
Keywords: پوشش الکتریکی مس; Ceramic; Polydopamine; Surface modification; Electroless copper plating; Adhesion;
Copper azide prepared by reaction of hollow CuO microspheres with moist HN3 gas
Keywords: پوشش الکتریکی مس; Copper azide; Hollow CuO microspheres; Electroless copper plating; Core-shell structure; Polystrene;
Electroless copper plating of tungsten powders and preparation of WCu20 composites by microwave sintering
Keywords: پوشش الکتریکی مس; Copper-coated tungsten powders; Electroless copper plating; Microwave sintering; Tungsten-copper composites; Microstructure;
Electrochemical and stress characteristics of SiO/Cu/expanded graphite composite as anodes for lithium ion batteries
Keywords: پوشش الکتریکی مس; Lithium ion batteries; Silicon monoxide; Electroless copper plating; Expanded graphite; Stress; Performance;
Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating
Keywords: پوشش الکتریکی مس; Laser direct writing; Selective metallization; Chemical cleaning; Electroless copper plating;
Electromagnetic shielding effectiveness and serviceability of the multilayer structured cuprammonium fabric/polypyrrole/copper (CF/PPy/Cu) composite
Keywords: پوشش الکتریکی مس; Cuprammonium fabric; Polypyrrole; Electroless copper plating; Shielding effectiveness; Serviceability
Influence of N-N dimethyl formamide on electroless copper plating using hypophosphite as reducing agent
Keywords: پوشش الکتریکی مس; Electroless copper plating; DMF; SEM/EDX; XRD; EIS; Cyclic voltammetry;
Parameters optimization of electroless deposition of Cu on Cr-coated diamond
Keywords: پوشش الکتریکی مس; electroless copper plating; Cr-coated diamond; parameter optimization;
Adhesion improvement of electroless copper to PC substrate by a low environmental pollution MnO2–H3PO4–H2SO4–H2O system
Keywords: پوشش الکتریکی مس; PC surface etching; Surface roughness; Electroless copper plating; Adhesion strength
Study of an environment-friendly surface pretreatment of ABS-polycarbonate surface for adhesion improvement
Keywords: پوشش الکتریکی مس; PC/ABS surface etching; Manganese dioxide colloid; Electroless copper plating; Adhesion strength
Relationship between peroxide radical species on plasma-treated PFA surface and adhesion strength of PFA/electroless copper-plating film
Keywords: پوشش الکتریکی مس; Atmospheric-pressure plasma; Peroxide; Adhesion strength; Electroless copper plating; PFA
Role of additives in electroless copper plating using hypophosphite as reducing agent
Keywords: پوشش الکتریکی مس; Electroless copper plating; Hypophosphite; Additives; Microstructure; Electrical resistivity
Electroless copper plating using dimethylamine borane as reductant
Keywords: پوشش الکتریکی مس; Electroless copper plating; DMAB; Polarization; Anodic oxidation; Cathodic reduction;
The effect of nickel on the strain evolution in chemical copper films
Keywords: پوشش الکتریکی مس; Electroless copper plating; Chemical copper plating; Stress analysis; Strain analysis; Sin2 psi method; X-ray diffraction
Vacuum-assisted electroless copper plating on Ni/(Sm,Ce)O2 anodes for intermediate temperature solid oxide fuel cells
Keywords: پوشش الکتریکی مس; Solid oxide fuel cells; Ni/SDC cermet anode; Electroless copper plating; Isolated TPBs; Cu network; Carbon deposition
Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition
Keywords: پوشش الکتریکی مس; Poly(ethylene terephthalate) film; Electroless copper plating; Ultrasonic assisted; Adhesion strength;
Ultrasonic-assisted fabrication of highly dispersed copper/multi-walled carbon nanotube nanowires
Keywords: پوشش الکتریکی مس; Multi-walled carbon nanotube; Electroless copper plating; Ultrasonic; Nanowires
Copper patterned polystyrene panels by reducing of surface bound Cu (II)-sulfonyl hydrazide complex
Keywords: پوشش الکتریکی مس; Electroless copper plating; Chlorosulfonation; Polystyrene, Sulfonylhydrazide; Copper deposition
Electroless copper plating on PET fabrics using hypophosphite as reducing agent
Keywords: پوشش الکتریکی مس; Electroless copper plating; PET fabric; Hypophosphite; Potassium ferrocyanide; Deposition rate; Crystal structure; Surface morphology; Surface resistance
New and clean strategy for the determination of Cu2+ in electroless copper plating baths
Keywords: پوشش الکتریکی مس; Electroless copper plating; Differential spectrophotometry; Clean strategy
Inkjet printing of palladium catalyst patterns on polyimide film for electroless copper plating
Keywords: پوشش الکتریکی مس; Inkjet printing; Polyimide; Electroless copper plating; Printed electrodes
Electrochemical Study on Electroless Copper Plating Using Sodium Hypophosphite as Reductant
Keywords: پوشش الکتریکی مس; Electroless copper plating; Sodium hypophosphite; Re-active agent; Anodic oxidation; Cathodic reduction;
Fabrication, microstructure and properties of SiCp/Cu heat sink materials
Keywords: پوشش الکتریکی مس; heat sink material; electroless copper plating; coefficient of thermal expansion; thermal conductivity;
Electroless plating of copper through successive pretreatment with silane and colloidal silver
Keywords: پوشش الکتریکی مس; Self-assembled molecular layer; Colloidal Ag; Electroless copper plating;
Electroless Cu-plated Ni3Sn4 alloy used as anode material for lithium ion battery
Keywords: پوشش الکتریکی مس; Lithium ion battery; Anode material; Ni3Sn4 alloy; High-energy ball-milling; Electroless copper plating;
Electroless copper coating on nickel foils in super-gravity field
Keywords: پوشش الکتریکی مس; Super-gravity; Electroless copper plating; Plating rate; Rotational speed;