کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
11020851 | 1715612 | 2019 | 29 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Characterization of a dual taper thermosiphon loop for CPU cooling in data centers
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The inefficient cooling processes in data centers consume a large amount of energy making them very expensive. This study is focuses on using a thermosiphon loop as an efficient replacement of currently used air cooling and water cooling techniques for dissipating large heat loads from the CPUs. A symmetric dual taper configuration is introduced in the evaporator to generate a highly efficient and stable two-phase flow in the system using HFE7000. Three different taper angles in the evaporator - 2°, 2.5°, and 3° - are studied, and the respective heat transfer performances are evaluated. The evaporator has 200â¯Âµm square microchannels machined on a 34.5â¯mmâ¯Ãâ¯32â¯mm copper heat sink. Prior to CPU testing, the dual taper evaporator performance is evaluated in a benchtop thermosiphon loop in which the evaporator is heated by electric heaters. The loop is able to dissipate 280â¯W without reaching the critical flux point with a heat transfer coefficient of 26â¯kW/m2 °C. The thermosiphon loop is then tested for cooling a data center server with an i7-930 processor with thermal design power (TDP) of 130â¯W. The cooling performance of the thermosiphon loop is compared with commercial air based and water based coolers in both server and benchtop configurations.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Thermal Engineering - Volume 146, 5 January 2019, Pages 450-458
Journal: Applied Thermal Engineering - Volume 146, 5 January 2019, Pages 450-458
نویسندگان
Aranya Chauhan, Satish G. Kandlikar,