کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1287307 | 973218 | 2006 | 7 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Effects of substrate morphology and ageing on cycle performance of a Sn-anode fabricated by electroplating Effects of substrate morphology and ageing on cycle performance of a Sn-anode fabricated by electroplating](/preview/png/1287307.png)
The effects of Cu substrate morphology and ageing on the cycle performance of a Sn-anode electroplated on a smooth, a pyramid and a nodule-type Cu substrate and aged at 200 °C for 0, 1, 5, 20 h in a vacuum were examined. The Sn-anode electroplated on the nodule-type Cu substrate and aged for 1 h exhibited the highest reversible capacity (up to ∼600 mAh g−1) and a stable cycle performance, which resulted from the enhancement in adhesion and electrical contact properties between the Sn layer and the Cu substrate by the mechanical interlocking effect of the nodule-type Cu substrate and also by the buffering effects of an intermetallic compound formed by the ageing process. However, when aged for longer than 1 h at 200 °C, the reversible capacity of the Sn-anode decreased significantly due to the formation of an inactive Cu3Sn phase, irrespective of the morphology of the Cu substrate.
Journal: Journal of Power Sources - Volume 159, Issue 2, 22 September 2006, Pages 1409–1415