کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1615638 | 1516355 | 2012 | 9 صفحه PDF | دانلود رایگان |
Cu–Ni–P alloy with unique microstructures were deposited by electroless plating. The effect of deposition parameters on the morphology, crystallographic texture and hydrophobic property of the as-prepared alloy was investigated. SEM observation reveals that the morphology of Cu–Ni–P deposits can be controlled by adjusting Ni2+ concentration, temperature and pH value. Cone structure with dimensions of about 5 μm in height and 0.5 μm in root diameter could be obtained by optimum parameters of 0.0024 M Ni2+, 70 °C, pH 9, 0.05 M sodium citrate and 50 ppm PEG10000 (or 4000). XRD results show that Cu–Ni–P cone structure is well-crystallized and exhibits strong (1 1 1) texture. When the concentration of Ni2+ and OH− increases, the surface of Cu–Ni–P coating is comparatively smooth and shows a preferred orientation of (2 2 0). Static contact angles were measured to investigate the surface’s wettability. The results reveal that Cu–Ni–P alloy with dense cone structure is hydrophobic with maximum static contact angle of 140°, while that of flat Cu–Ni–P alloy is 93°.
► Cone-structured Cu–Ni–P alloy was fabricated by electroless plating.
► Influence of deposition parameters on morphology and structure were investigated.
► Cu–Ni–P cone structure is hydrophobic with maximum contact angle of 140°.
Journal: Journal of Alloys and Compounds - Volume 538, 15 October 2012, Pages 144–152