Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy

Creep behavior of Sn–40%Pb–2.5%Sb peritectic solder alloy having two different grain sizes was studied by indentation, impression, stress relaxation and conventional creep tests at room temperature (T > 0.65 Tm) in order to evaluate the correspondence of the creep results. Stress exponent values have been determined through these methods and in all cases the calculated exponents are in good agreement. The stress exponent values in the range 2.55–3.20, depending on the testing method and grain size of the materials, indicate that grain boundary sliding is the possible mechanism during room-temperature creep deformation of this alloy.