Failure Mechanism of Reflow Conductor Roll of Electroplating Tinning Line

The surface roughness of reflow conductor roll was checked on membrane sample. The surface morphology of conductor roll was observed by microscope, and the composition of adhered layer on conductor roll surface was analyzed by X-ray spectroscope. The results show that tin adhesion is the main reason for failure of conductor roll, and the failure of conductor roll is accelerated by wear. The measures to decrease tin adhesion and improve wear resistance were put forward.