Atomic layer deposition of copper and copper silver films using an electrochemical process

• Layer-by-layer growth of Cu and Cu(Ag) films are prepared using electrochemical atomic layer deposition.
• Cu coverage is from 0.33 to 0.51 ML for each deposition cycle in different NaCl concentrations.
• The process can be applied in Cu interconnections.

This paper describes the formation and properties of Cu and Cu(Ag) films on a Ru/Si substrate using electrochemical atomic layer deposition. The process was performed layer-by-layer using underpotential deposition (UPD) and surface-limited redox reactions. The first Cu atomic layer was deposited on the Ru/Si substrate via UPD. Using UPD, atomic layered of Pb, which acts as a sacrificial layer, was applied on the Cu layer. Then, a Cu2 + solution was flushed into the cell at an open-circuit potential, and the Pb layer was exchanged for Cu via redox replacements. The above sequences were repeated 500 times to form a Cu film. The Cu(Ag) alloy films were formed using Cu–UPD and Ag–UPD in predetermined sequences. The lowest electrical resistivity achieved was 3.6 and 2.2 μΩ cm for the Cu film and Cu(Ag) film, respectively, after annealing at 400 °C. Due to the self-limiting reactions, the process has the ability to deposit atomic layers to meet the requirement of Cu interconnects.