Effect of microstructure on corrosion behavior of TiN hard coatings produced by a modified two-grid attachment magnetron sputtering process

The introduction of an electrically biased two-grid attachment inside a conventional physical vapor deposition process system produces a reactive coating deposition and increases the metal ion-to-neutral ratio in the plasma, resulting in denser and smoother films.The corrosion behavior of titanium nitride (TiN) coatings was investigated by electrochemical methods, such as potentiodynamic polarization test and electrochemical impedance spectroscopy (EIS) in deaerated 3.5% NaCl solution. Electrochemical tests were used to evaluate the effect of microstructure on the corrosion behavior of TiN coatings exposed to a corrosive environment. The crystal structure of the coatings was examined by X-ray diffractometry and the microstructure of the coatings was investigated by scanning electron microscopy.In the potentiodynamic polarization test and EIS measurement, the corrosion current density of TiN deposited by the modified two-grid attachment magnetron sputtering process was lower than for TiN deposited by conventional magnetron type and also presented higher charge-transfer resistance values during 240 h total immersion time. The modified process promotes the grain refinement, which yields lower porosity.