Effect of parameters of square-wave pulsating current on copper electrodeposition in the hydrogen co-deposition range

Copper electrodeposition processes in the hydrogen co-deposition range by the pulsating current (PC) regime were examined by the determination of the average current efficiency of hydrogen evolution and by the scanning electron microscopic (SEM) analysis of the morphology of the formed deposits. The two sets of the square-wave PC of the same pause to pulse ratios, but with different duration of deposition pulses and pauses were analyzed. The one set of square-wave PC was with the constant pause duration and different deposition pulses. In the other set, the deposition pulse was constant while the pause duration was varied. The obtained results were compared with those obtained by electrodeposition at the constant overpotential from solutions of different CuSO4 and H2SO4 concentrations. It was found that the effect of the increasing deposition pulse was equivalent to the decreasing CuSO4 concentration, while the effect of the decreasing pause duration was equivalent to the increasing H2SO4 concentration. It is shown that it is possible to achieve a substitution of more solutions of different CuSO4 and H2SO4 concentartions by the use of the only one solution if the appropriate PC parameters were applied, what can be of high technological significance.